Effect and Mechanism of Solidified Microstructure on Deformation Behavior, Mechanical Properties, and Residual Stress of Cu-Ni-Si Alloy
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DOI: 10.3390/ma15248724
Abstract: Cu-Ni-Si alloy is the key raw material for the lead frame of large integrated circuits. The disordered grain orientation of alloy billet, high hardening rate, residual stress, and poor surface quality of cold working strips… read more here.
Keywords: deformation; residual stress; solidified microstructure; columnar grain ... See more keywords