Degradation of inhibitor in alkaline cleaning solution for post-Cu CMP cleaning
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DOI: 10.1016/j.surfcoat.2018.02.039
Abstract: Abstract In this current work, the degradation of the commercial alkaline cleaning solution for post-Cu chemical mechanical planarization (CMP) cleaning process was systemically investigated. According to the results of electrochemical measurements and X-ray photoelectron spectroscopy,… read more here.
Keywords: solution post; degradation; cleaning solution; alkaline cleaning ... See more keywords