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Published in 2025 at "Journal of Micromechanics and Microengineering"
DOI: 10.1088/1361-6439/ada61b
Abstract: As the demands in function versatility, integration density and mass manufacturability grow, multilayer thermoplastic microfluidic devices with sophisticated structures have rapidly gained interests. Yet, great challenges persist in packaging process, namely alignment and sealing of…
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Keywords:
solvent;
solvent enabled;
alignment free;
free solvent ... See more keywords