Solving the critical thermal bowing in 3C-SiC/Si(111) by a tilting Si pillar architecture
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DOI: 10.1063/1.5019325
Abstract: The exceptionally large thermal strain in few-micrometers-thick 3C-SiC films on Si(111), causing severe wafer bending and cracking, is demonstrated to be elastically quenched by substrate patterning in finite arrays of Si micro-pillars, sufficiently large in… read more here.
Keywords: thermal bowing; critical thermal; aspect ratio; sic 111 ... See more keywords