Comparative analysis of modeling and experiments to study spalling process in Si wafers
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DOI: 10.1063/1.4978338
Abstract: A comparative analysis including modeling and experimental evaluation of a spalling process of silicon (Si) substrates was accomplished to define the optimum condition for uniform spalling. The residual stresses in Nickle (Ni) films on Si… read more here.
Keywords: spalling process; comparative analysis; analysis modeling; analysis ... See more keywords