Analysis and modeling of wafer-level process variability in 28 nm FD-SOI using split C-V measurements
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DOI: 10.1016/j.sse.2018.04.001
Abstract: Abstract This work details the analysis of wafer level global process variability in 28 nm FD-SOI using split C-V measurements. The proposed approach initially evaluates the native on wafer process variability using efficient extraction methods on… read more here.
Keywords: wafer level; variability soi; variability; process ... See more keywords