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Published in 2024 at "Nature Communications"
DOI: 10.1038/s41467-024-54017-3
Abstract: Film-thermoelectric cooling devices are expected to provide a promising active thermal management solution with the continues increase of the power density of integrated circuit chips and other electronic devices. However, because the microstructure-related performance of…
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Keywords:
hot spot;
based films;
spot elimination;
bi2te3 based ... See more keywords