Two-Step Plasma Treatment on Sputtered and Electroplated Cu Surfaces for Cu-To-Cu Bonding Application
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DOI: 10.3390/app9173535
Abstract: The technology trends of next generation electronic packaging are moving toward heterogeneous 3D packaging systems. One of the key processes of 3D packaging system is Cu-to-Cu bonding, which is highly dependent on the planarized, activated,… read more here.
Keywords: plasma treatment; sputtered electroplated; two step; step plasma ... See more keywords