Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method
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DOI: 10.1007/s40195-019-00875-6
Abstract: Target assembly is a key consumable material for producing thin film used in the electronic packaging and devices. The residual stresses induced during the process of soldering are detrimental to the performance of target assembly.… read more here.
Keywords: finite element; sputtering target; target; taguchi method ... See more keywords