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Published in 2019 at "Advanced Electronic Materials"
DOI: 10.1002/aelm.201800627
Abstract: Building 3D electronics represents a promising method for the integration of more functionalities into a given footprint. To this end, stacked multilevel silicon nanowires (SiNWs) are ideal multilevel channels to construct high‐density 3D electronics. 3D…
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Keywords:
integration;
density;
channel electronics;
stacked channel ... See more keywords
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Published in 2020 at "Nanoscale"
DOI: 10.1039/c9nr09000b
Abstract: Three-dimensional (3D) integration is a promising strategy to integrate more functions into a given footprint. In this work, we report on a convenient new strategy to grow and integrate high density Si nanowire (SiNW) arrays…
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Keywords:
channel transistors;
facile integration;
stacked channel;
integration nanowires ... See more keywords
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Published in 2022 at "Micromachines"
DOI: 10.3390/mi13122099
Abstract: Amorphous InGaZnO thin film transistors (a-IGZO TFTs) with double-stacked channel layers (DSCL) were quite fit for ultraviolet (UV) light detection, where the best DSCL was prepared by the depositions of oxygen-rich (OR) IGZO followed by…
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Keywords:
stacked channel;
ingazno thin;
amorphous ingazno;
double stacked ... See more keywords