Improving DRAM Performance in 3-D ICs via Temperature Aware Refresh
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DOI: 10.1109/tvlsi.2016.2606085
Abstract: The 3-D integration allows IC designs to stack DRAM directly on the top of execution units, which greatly reduces DRAM access latency and improves memory bandwidth. Unfortunately, the heat generated by the processor unit cannot… read more here.
Keywords: temperature; temperature aware; improving dram; aware refresh ... See more keywords