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Published in 2022 at "Micromachines"
DOI: 10.3390/mi13122101
Abstract: To study the working performance of 3D stacked chips, a double-layer stacked GaN MISHEMTs structure was designed to study the electro-thermal characteristics and heat transfer process of stacked chips. Firstly, the electrical characteristics of double-layer…
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Keywords:
double layer;
layer;
thermal characteristics;
stacked gan ... See more keywords