Multi-Stage Organic Logic Circuits Using Via-Hole-Less Metal Interconnects
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DOI: 10.1109/led.2020.3027423
Abstract: Multi-metal interconnection is a crucial technology for the development of large-scale integrated circuits (ICs). However, organic semiconductors are not robust enough to be compatible with conventional lithography-and-etching-based via-forming methods. Thus, an alternative metal interconnect method… read more here.
Keywords: metal; logic circuits; multi stage; organic logic ... See more keywords