Stealth dicing of 1-mm-thick glass with aberration-free axial multi-focus beams.
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DOI: 10.1364/ol.460947
Abstract: Laser stealth dicing can realize material separation with negligible surface damage, but severe aberrations in thick materials degrade processing quality. This Letter presents a nonlinear point-to-point transformation method combined with spherical aberration compensation to achieve… read more here.
Keywords: aberration; stealth dicing; aberration free; free axial ... See more keywords
Precision Layered Stealth Dicing of SiC Wafers by Ultrafast Lasers
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DOI: 10.3390/mi13071011
Abstract: With the intrinsic material advantages, silicon carbide (SiC) power devices can operate at high voltage, high switching frequency, and high temperature. However, for SiC wafers with high hardness (Mohs hardness of 9.5), the diamond blade… read more here.
Keywords: sic wafers; stealth dicing; layered stealth; ultrafast lasers ... See more keywords