Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating
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DOI: 10.1016/j.apsusc.2016.09.152
Abstract: Abstract A simple and low-cost process for fabricating conductive copper patterns on flexible polyimide substrates was demonstrated. Copper catalyst patterns were first produced on polyimide substrates using reactive inkjet printing of Cu (II)-bearing ink and… read more here.
Keywords: copper; copper patterns; electroless plating; conductive copper ... See more keywords