Residual Thermal Strain Distribution Measurement of Underfills in Flip Chip Electronic Packages by an Inverse Approach Based on the Sampling Moiré Method
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DOI: 10.1007/s11340-019-00571-7
Abstract: Residual deformation evaluation of underfill (UF) materials in flip chips is crucial to improve the reliability of electronic packages. In this study, we propose to evaluate the residual thermal strain distributions using an inverse method… read more here.
Keywords: temperature; strain distributions; method; residual thermal ... See more keywords
Determining the strengths of HCP slip systems using harmonic analyses of lattice strain distributions
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DOI: 10.1016/j.actamat.2017.10.032
Abstract: Abstract A robust methodology is presented to extract slip system strengths from lattice strain distributions for polycrystalline samples obtained from high-energy x-ray diffraction (HEXD) experiments with in situ loading. The methodology consists of matching the… read more here.
Keywords: methodology; slip; lattice strain; strain distributions ... See more keywords
Bamboo/Wood Composites and Structures Shear and Normal Strain Distributions in Multilayer Composite Laminated Panels under Out-of-Plane Bending
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DOI: 10.1155/2021/6637853
Abstract: Innovative mass timber panels, known as composite laminated panels (CLP), have been developed using lumber and laminated strand lumber (LSL) laminates. In this study, strain distributions of various 5-layer CLP and cross-laminated timber (CLT) were… read more here.
Keywords: shear analogy; laminated panels; strain distributions; composite laminated ... See more keywords