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Published in 2019 at "Sensors and Materials"
DOI: 10.18494/sam.2019.2359
Abstract: Ultrasonic vibration is a promising assistant technology to improve the microforming processes, for example, decreasing friction, enhancing surface finishing, and reducing forming load/stress. However, the mechanism behind the forming stress reduction due to ultrasonic vibration,…
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Keywords:
stress superposition;
acoustic softening;
stress reduction;
stress ... See more keywords
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Published in 2021 at "Materials"
DOI: 10.3390/ma15010192
Abstract: In this paper, the stress superposition method (SSM) is proposed to solve the stress distribution of regular polygon membranes. The stress-solving coefficient and the calculation formula of arbitrary point stress of regular polygon membrane are…
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Keywords:
stress superposition;
membrane;
method;
regular polygon ... See more keywords