Articles with "structures dies" as a keyword



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Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates

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Published in 2023 at "Micromachines"

DOI: 10.3390/mi14020415

Abstract: Emerging trends like the Internet of Things require an increasing number of different sensors, actuators and electronic devices. To enable new applications, such as wearables and electronic skins, flexible sensor technologies are required. However, established… read more here.

Keywords: paradigm changing; changing integration; flexible substrates; structures dies ... See more keywords