Experimental investigations in the intermetallic and microvoid formation in sub-200 °C Cu–Sn bonding
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DOI: 10.1007/s10854-019-02017-1
Abstract: This paper reports the intermetallic growth and microvoid formation in the Cu–Sn layers, which were annealed at low temperatures (sub-200°C) for durations varying from 120 to 1440 min. A 10 µm thick tin was electrodeposited… read more here.
Keywords: bonding; sub 200; microvoid formation; within cu3sn ... See more keywords