Large-Area Substrate Bonding With Single-Printing Silver Paste Sintering for Power Modules
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DOI: 10.1109/tcpmt.2020.3032962
Abstract: Sintered silver with high thermal conductivity and reliability has been considered as a promising substrate bonding solution in power modules. The traditional double printing process is complex, and the second layer of silver paste is… read more here.
Keywords: sintered silver; printing; process; substrate bonding ... See more keywords