110-GHz Through-Substrate-Via Transition Based on Copper Nanowires in Alumina Membrane
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DOI: 10.1109/tmtt.2017.2763142
Abstract: A new through-substrate via (TSV) for millimeter-wave frequencies is proposed. The via is formed by copper nanowires connecting the bottom and top surfaces of a porous alumina membrane. It is shown here that the nanowire… read more here.
Keywords: substrate via; alumina membrane; copper nanowires; 110 ghz ... See more keywords