Communication—Triphenylmethane-Based Leveler for Microvia Filling in Copper Super-Conformal Electroplating
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DOI: 10.1149/2.0531913jes
Abstract: Levelers exhibiting high microvia-filling power and wide operating-concentration ranges are required for the development of additives in copper super-conformal electroplating. In this study, a novel structure based on triphenylmethane (TPM-1) was synthesized and investigated as… read more here.
Keywords: microvia filling; microvia; super conformal; conformal electroplating ... See more keywords