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Published in 2018 at "IEEE Transactions on Electron Devices"
DOI: 10.1109/ted.2018.2870174
Abstract: An analytical model for the power vertical MOS device with a high-k insulating dielectric (HKMOS) is derived via the superposition methodology on the condition of punchthrough. Considering three portions—the superjunction part, the p-i-n diode, and…
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Keywords:
power vertical;
superposition methodology;
methodology;
mos device ... See more keywords