Surface Silanization of Polyimide for Autocatalytic Metallization
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DOI: 10.1007/s11837-020-04286-2
Abstract: Due to its superior chemical stability, mechanical strength, light weight, and flexibility, polyimide (PI) has been widely used as a polymeric substrate of flexible printed circuit boards such as flexible copper clad laminates (FCCLs). The… read more here.
Keywords: silanization polyimide; autocatalytic metallization; metallization; surface silanization ... See more keywords