Aerosol Jet Printed, Microwave Microstrip Ring Resonators for System-In-Package Applications
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2020.3025186
Abstract: This article presents the design, simulation, and fabrication of printed microstrip transmission line (TL) and microwave ring resonators using aerosol-jet printing for system-in-package applications. The printed TLs are 8 mm long and their S-parameters are… read more here.
Keywords: aerosol jet; package applications; system package; package ... See more keywords
A Ku-Band Miniaturized System-in-Package Using HTCC for Radar Transceiver Module Application
Sign Up to like & getrecommendations! Published in 2022 at "Micromachines"
DOI: 10.3390/mi13111817
Abstract: This paper introduces a miniaturized system in package (SIP) for a Ku-band four-channel RF transceiver front-end. The SIP adopts the packaging scheme of an inner heat-dissipation gasket and multi-layer substrate in the high temperature co-fired… read more here.
Keywords: system package; transceiver; radar transceiver; miniaturized system ... See more keywords