Integrated Systems-in-Package: Heterogeneous Integration of Millimeter-Wave Active Circuits and Passives in Fan-Out Wafer-Level Packaging Technologies
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Microwave Magazine"
DOI: 10.1109/mmm.2017.2759558
Abstract: Recent advances in silicon semiconductor technology with transit and maximum oscillation frequencies above 300 GHz have enabled the integration of complex transceiver front ends operating in the millimeter-wave (mmW) regime for a variety of applications.… read more here.
Keywords: integrated systems; integration; systems package; millimeter wave ... See more keywords