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Published in 2017 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2017.2676838
Abstract: We present a versatile electro-optical packaging platform for optical transceiver modules suitable for very high aggregate I/O capacity, as required, for example, in (disaggregated) datacenters and servers. Real-estate limitations on the board or on the…
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Keywords:
technology optical;
optical transceiver;
transceiver;
circuit ... See more keywords