POSS‐reinforced covalent network in epoxy adhesive and its improvement in the high‐temperature adhesion, toughness, and transparency
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DOI: 10.1002/app.56300
Abstract: Developing epoxy structural adhesives with excellent high‐temperature adhesion remains a great challenge. The incorporation of fillers can enhance the performance of epoxy adhesives, albeit at the expense of reduced high‐temperature adhesion properties. Polyhedral oligomeric silsesquioxanes… read more here.
Keywords: temperature; poss reinforced; temperature adhesion; adhesion ... See more keywords