A low-temperature bonding method for high power device packaging based on In-infiltrated nanoporous Cu
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-020-03970-y
Abstract: With the rapid development of the third-generation semiconductor materials, an appropriate high-temperature-resistant die attach material has become one of the bottlenecks to fully exploit the excellent properties of the third-generation semiconductor power devices. At the… read more here.
Keywords: low temperature; bonding method; temperature bonding; temperature ... See more keywords
Room temperature bonding of aluminum nitride ceramic and semiconductor substrate
Sign Up to like & getrecommendations! Published in 2020 at "Ceramics International"
DOI: 10.1016/j.ceramint.2020.07.083
Abstract: Abstract AlN and Si substrates were bonded at room temperature after sputtering the surfaces under ultra-high vacuum conditions. The bonding strength was insignificant when they were directly bonded. However, the strong bonding equivalent to the… read more here.
Keywords: temperature bonding; bonding aluminum; room temperature; room ... See more keywords
Enhancement of Low-Temperature Al-Al Bonding for Cost-Effective 3D Integration
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DOI: 10.1109/led.2025.3601663
Abstract: Al-Al bonding is considered as a promising alternative for direct metal bonding applications providing low-cost fine-pitch interconnections with minimum additional process effort and complexity. Conventional Al-Al thermocompression bonding requires high temperature ( $\gt 300~^{\circ }$… read more here.
Keywords: temperature; temperature bonding; inline formula; low temperature ... See more keywords
Effects of Au Passivation Thickness on Improving Low-Temperature Cu-to-Cu Bonding Interface
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2025.3526663
Abstract: With the continuous advancement of IT technology, the demand for multifunctional and high-performance semiconductor devices continues to rise. Therefore, there is significant interest in semiconductor packaging technology, and research on 3-D packaging technology is gaining… read more here.
Keywords: technology; temperature bonding; bonding interface; low temperature ... See more keywords