Low Temperature Copper-Copper Bonding of Non-Planarized Copper Pillar With Passivation
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DOI: 10.1109/led.2020.3001163
Abstract: Low-thermal-budget (180 °C for 15 sec) Cu pillar to Cu pillar bonding with Pd passivation under the atmosphere is developed without any planarization pretreatment before the bonding process. The bonded structure is investigated with material… read more here.
Keywords: passivation; copper; temperature copper; copper copper ... See more keywords