Low temperature epoxy bonding for RF MEMS capacitive switch
Sign Up to like & getrecommendations! Published in 2018 at "Microsystem Technologies"
DOI: 10.1007/s00542-018-4186-6
Abstract: Packaging is one of the most critical tasks for MEMS devices. Unlike solid state devices, MEMS structures involves moving structures which needs to be protected from outer environment ensuring free movement of the structure. In… read more here.
Keywords: low temperature; epoxy bonding; temperature epoxy; switch ... See more keywords
Properties of high-temperature epoxy/DDS resin systems for bonding application
Sign Up to like & getrecommendations! Published in 2019 at "High Performance Polymers"
DOI: 10.1177/0954008319888002
Abstract: The choice of basic epoxy resin (ER) is especially important for the design of epoxy adhesive formulations. In the present study, performance of several high-temperature ER systems, prepared using 4,4-diaminodiphenylsulfone as the curing agent by… read more here.
Keywords: resin; temperature; temperature epoxy; high temperature ... See more keywords