Laser sealing of organic light-emitting diode using low melting temperature glass frit
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DOI: 10.1007/s11082-017-1046-z
Abstract: Glass frit encapsulation for laser-base sealing of the complex interiors results challenges for the electronics manufacturing process. The conventional frit packaging method relies on elevating thermal process by furnace where the package is heated to… read more here.
Keywords: temperature glass; glass frit; frit; laser ... See more keywords