Sign Up to like & get
recommendations!
0
Published in 2020 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2020.155349
Abstract: Abstract The temperature required for growth of mullite whiskers in heat-resistant adhesive was decreased to 700 °C based on solid-liquid-solid (S-L-S) mechanism. The bonding strength was increased by 23.1% (700 °C) ∼ 60.7% (1200 °C), and the maximal 32.3 MPa…
read more here.
Keywords:
low temperature;
mullite whiskers;
heat resistant;
temperature situ ... See more keywords
Sign Up to like & get
recommendations!
0
Published in 2019 at "Microscopy and Microanalysis"
DOI: 10.1017/s1431927619008432
Abstract: The most common method for controlling structure through processing is through simple thermal excursions, as temperature causes atomic diffusion, and thus allows structural re-ordering. The primary experimental method used to determine the local internal structure…
read more here.
Keywords:
microscopy;
optimized high;
transmission electron;
high temperature ... See more keywords