A Review of Low-Temperature Solders in Microelectronics Packaging
Sign Up to like & getrecommendations! Published in 2023 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2023.3271269
Abstract: The shift to lead-free solder alternatives led to the development of Sn–Ag–Cu (SAC) alloys as the most used solders due to their superior mechanical properties and reliability. However, their melting range (217 °C–222 °C) is… read more here.
Keywords: based solders; temperature solders; low temperature; review ... See more keywords