Development of three-dimensional wafer level chip scale packaging using via last TSV and UV laser releasable temporary bonding technologies
Sign Up to like & getrecommendations! Published in 2021 at "Microsystem Technologies"
DOI: 10.1007/s00542-021-05228-x
Abstract: 3D WLCSP with via last TSV and UV laser releasable temporary bonding technologies is an ideal scheme to meet the increasing high performance, low cost and small-form-factor requirements. In present paper, we demonstrate a thin… read more here.
Keywords: laser; temporary bonding; last tsv; via last ... See more keywords
PPC-based bilayer temporary bonding and debonding
Sign Up to like & getrecommendations! Published in 2017 at "Microelectronic Engineering"
DOI: 10.1016/j.mee.2017.05.029
Abstract: Abstract A novel temporary bonding and debonding using polypropylene carbonate (PPC)-based bilayer has been proposed and investigated in this paper for the first time. Photo acid generator (PAG) and copper nanopowder are investigated as PPC… read more here.
Keywords: based bilayer; temporary bonding; ppc based; bonding debonding ... See more keywords