Testing 3D-SoCs Using 2-D Time-Division Multiplexing
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DOI: 10.1109/tcad.2017.2780054
Abstract: Through-silicon vias (TSVs) are used as high-speed vertical interconnects between dies in a 3-D system-on-a-chip (SoC). However, their speed cannot be exploited during test application due to inherent limitations of the scan-chains of the cores,… read more here.
Keywords: division multiplexing; time; test; time division ... See more keywords