1-(4-Hydroxyphenyl)-2H-tetrazole-5-thione as a leveler for acid copper electroplating of microvia
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DOI: 10.1039/d2ra02274e
Abstract: Microvia filling by copper electroplating was performed using plating solution with 1-(4-hydroxyphenyl)-2H-tetrazole-5-thione (HPTT) as the leveler. Galvanostatic Measurements (GMs), Linear Sweep Voltammetry (LSV) and Electrochemical Impedance Spectroscopy (EIS) tests were carried out to investigate the… read more here.
Keywords: copper; hptt; tetrazole thione; copper electroplating ... See more keywords