Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias.
Sign Up to like & getrecommendations! Published in 2022 at "Journal of the Electrochemical Society"
DOI: 10.1149/1945-7111/ac5ad8
Abstract: The microstructure and crystallographic texture of copper electrodeposits in millimeter scale through silicon vias are characterized using electron backscatter diffraction. The deposits obtained from additive-containing CuSO4-H2SO4 electrolytes are characteristic of the superconformal deposition process, with… read more here.
Keywords: texture copper; silicon vias; growth; millimeter scale ... See more keywords