Electrical–Thermal Characterization of Through Packaging Vias in Glass Interposer
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DOI: 10.1109/tnano.2017.2722686
Abstract: Low-cost thin glass is developed as a promising material to advanced interposers for high density electrical interconnection in 2.5-D and three-dimensional (3-D) integration. In this paper, the electrical–thermal performance of through glass vias is investigated.… read more here.
Keywords: tgvs; electrical thermal; glass; glass interposer ... See more keywords