Design and implementation of thermal collection networks in 3-D IC structures
Sign Up to like & getrecommendations! Published in 2022 at "Heliyon"
DOI: 10.1016/j.heliyon.2022.e08719
Abstract: The empirical affirmation in the electronics industry is that the power of chips per unit area is growing exponentially. The amount of heat generated is equal to the power; hence as power per unit area… read more here.
Keywords: implementation thermal; heat; collection networks; design implementation ... See more keywords