Soft and Self‐Adhesive Thermal Interface Materials Based on Vertically Aligned, Covalently Bonded Graphene Nanowalls for Efficient Microelectronic Cooling
Sign Up to like & getrecommendations! Published in 2021 at "Advanced Functional Materials"
DOI: 10.1002/adfm.202104062
Abstract: Urged by the increasing power and packing densities of integrated circuits and electronic devices, efficient dissipation of excess heat from hot spot to heat sink through thermal interface materials (TIMs) is a growing demand to… read more here.
Keywords: aligned covalently; thermal interface; covalently bonded; interface materials ... See more keywords
Chloroform‐Assisted Rapid Growth of Vertical Graphene Array and Its Application in Thermal Interface Materials
Sign Up to like & getrecommendations! Published in 2022 at "Advanced Science"
DOI: 10.1002/advs.202200737
Abstract: With the continuous progress in electronic devices, thermal interface materials (TIMs) are urgently needed for the fabrication of integrated circuits with high reliability and performance. Graphene as a wonderful additive is often added into polymer… read more here.
Keywords: interface materials; graphene; rapid growth; growth ... See more keywords
Scalable thermal interface materials with close‐packed structure and high through‐plane thermal conductivity
Sign Up to like & getrecommendations! Published in 2025 at "Polymer Composites"
DOI: 10.1002/pc.29613
Abstract: Now, composite films exhibiting high in‐plane thermal conductivity have received considerable attention as potential thermal interface materials. However, for real‐world thermal management applications, there is a growing need for soft TIMs with higher through‐plane thermal… read more here.
Keywords: conductivity; thermal interface; high plane; plane thermal ... See more keywords
Highly conductive flexible thermal interface material based on vertically oriented continuous carbon fiber arrays anchored in silicone rubber
Sign Up to like & getrecommendations! Published in 2025 at "Polymer Composites"
DOI: 10.1002/pc.29691
Abstract: As the power density of integrated circuits in electronic devices continues to rise, thermal management has emerged as a critical technical barrier limiting performance enhancement. To address this challenge, an innovative‐oriented filler strategy has been… read more here.
Keywords: material; thermal interface; vertically oriented; continuous carbon ... See more keywords
Thermal Interface Materials With Excellent Flexibility and Adhesion via Chain Segment Structure Design
Sign Up to like & getrecommendations! Published in 2025 at "Polymer Composites"
DOI: 10.1002/pc.70140
Abstract: Effective heat dissipation is essential for optimizing the performance and extending the service life of electronic devices. However, developing thermal interface materials (TIMs) that integrate excellent stretchability, self‐adhesiveness, and high thermal conductivity still represents a… read more here.
Keywords: structure; interface materials; thermal interface; thermal conductivity ... See more keywords
High Thermal Conductivity of Sandwich-Structured Flexible Thermal Interface Materials.
Sign Up to like & getrecommendations! Published in 2023 at "Small"
DOI: 10.1002/smll.202207015
Abstract: Thermal interfaces are vital for effective thermal management in modern electronics, especially in the emerging fields of flexible electronics and soft robotics that impose requirements for interface materials to be soft and flexible in addition… read more here.
Keywords: interface materials; sandwich; sandwich structured; high thermal ... See more keywords
Regulatable Orthotropic 3D Hybrid Continuous Carbon Networks for Efficient Bi-Directional Thermal Conduction
Sign Up to like & getrecommendations! Published in 2024 at "Nano-Micro Letters"
DOI: 10.1007/s40820-024-01426-0
Abstract: A composite thermal interface material with three-dimensional hybrid carbon network-reinforced polydimethylsiloxane was proposed. The cooperative regulation of thermal conductivity and mechanical properties was achieved by controlling the assembly process of micro-nano scale unit carbon materials.… read more here.
Keywords: carbon; plane; thermal interface; thermal conductivity ... See more keywords
A molecular dynamics study on heat conduction of crosslinked epoxy resin based thermal interface materials for thermal management
Sign Up to like & getrecommendations! Published in 2020 at "Computational Materials Science"
DOI: 10.1016/j.commatsci.2019.109298
Abstract: Abstract The epoxy resin is one of important thermal interface materials which can reduce thermal contact resistance of microelectronic devices. In the interest of relation between heat conduction and crosslinks, the thermal conductivities of epoxy… read more here.
Keywords: resin; molecular dynamics; epoxy resin; thermal interface ... See more keywords
Spherical core-shell Al@Al2O3 filled epoxy resin composites as high-performance thermal interface materials
Sign Up to like & getrecommendations! Published in 2019 at "Composites Part A: Applied Science and Manufacturing"
DOI: 10.1016/j.compositesa.2019.05.024
Abstract: Abstract With the miniaturization, high power density, and high integration of modern electronics, heat accumulation has emerged as a critical issue that affects their performance and reliability. The application of thermal interface materials is a… read more here.
Keywords: epoxy resin; thermal interface; performance; shell ... See more keywords
Enhanced performance of photovoltaic–thermoelectric coupling devices with thermal interface materials
Sign Up to like & getrecommendations! Published in 2020 at "Energy Reports"
DOI: 10.1016/j.egyr.2019.12.001
Abstract: Abstract In this study, thermal interface material is used in photovoltaic–thermoelectric coupling device to enhance the utilization of solar energy. An operating system including cooling equipment is established. The output performance evolutions of PV–TE coupling… read more here.
Keywords: thermal interface; photovoltaic thermoelectric; performance; coupling devices ... See more keywords
Microstructure design and analysis of thermal interface materials using high heat- resistance natural fibers
Sign Up to like & getrecommendations! Published in 2021 at "Journal of Industrial and Engineering Chemistry"
DOI: 10.1016/j.jiec.2021.06.003
Abstract: Abstract This study indicates the importance of structure optimization and analysis for investigating direct screen-printed pastes of carbon based microstructures for use in flexible thermal interface material (TIM). The basalt fiber that is used as… read more here.
Keywords: thermal interface; interface; basalt particles; interface materials ... See more keywords