Articles with "thermal interface" as a keyword



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Soft and Self‐Adhesive Thermal Interface Materials Based on Vertically Aligned, Covalently Bonded Graphene Nanowalls for Efficient Microelectronic Cooling

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Published in 2021 at "Advanced Functional Materials"

DOI: 10.1002/adfm.202104062

Abstract: Urged by the increasing power and packing densities of integrated circuits and electronic devices, efficient dissipation of excess heat from hot spot to heat sink through thermal interface materials (TIMs) is a growing demand to… read more here.

Keywords: aligned covalently; thermal interface; covalently bonded; interface materials ... See more keywords
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Chloroform‐Assisted Rapid Growth of Vertical Graphene Array and Its Application in Thermal Interface Materials

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Published in 2022 at "Advanced Science"

DOI: 10.1002/advs.202200737

Abstract: With the continuous progress in electronic devices, thermal interface materials (TIMs) are urgently needed for the fabrication of integrated circuits with high reliability and performance. Graphene as a wonderful additive is often added into polymer… read more here.

Keywords: interface materials; graphene; rapid growth; growth ... See more keywords
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High Thermal Conductivity of Sandwich-Structured Flexible Thermal Interface Materials.

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Published in 2023 at "Small"

DOI: 10.1002/smll.202207015

Abstract: Thermal interfaces are vital for effective thermal management in modern electronics, especially in the emerging fields of flexible electronics and soft robotics that impose requirements for interface materials to be soft and flexible in addition… read more here.

Keywords: interface materials; sandwich; sandwich structured; high thermal ... See more keywords
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A molecular dynamics study on heat conduction of crosslinked epoxy resin based thermal interface materials for thermal management

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Published in 2020 at "Computational Materials Science"

DOI: 10.1016/j.commatsci.2019.109298

Abstract: Abstract The epoxy resin is one of important thermal interface materials which can reduce thermal contact resistance of microelectronic devices. In the interest of relation between heat conduction and crosslinks, the thermal conductivities of epoxy… read more here.

Keywords: resin; molecular dynamics; epoxy resin; thermal interface ... See more keywords
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Spherical core-shell Al@Al2O3 filled epoxy resin composites as high-performance thermal interface materials

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Published in 2019 at "Composites Part A: Applied Science and Manufacturing"

DOI: 10.1016/j.compositesa.2019.05.024

Abstract: Abstract With the miniaturization, high power density, and high integration of modern electronics, heat accumulation has emerged as a critical issue that affects their performance and reliability. The application of thermal interface materials is a… read more here.

Keywords: epoxy resin; thermal interface; performance; shell ... See more keywords
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Enhanced performance of photovoltaic–thermoelectric coupling devices with thermal interface materials

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Published in 2020 at "Energy Reports"

DOI: 10.1016/j.egyr.2019.12.001

Abstract: Abstract In this study, thermal interface material is used in photovoltaic–thermoelectric coupling device to enhance the utilization of solar energy. An operating system including cooling equipment is established. The output performance evolutions of PV–TE coupling… read more here.

Keywords: thermal interface; photovoltaic thermoelectric; performance; coupling devices ... See more keywords
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Microstructure design and analysis of thermal interface materials using high heat- resistance natural fibers

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Published in 2021 at "Journal of Industrial and Engineering Chemistry"

DOI: 10.1016/j.jiec.2021.06.003

Abstract: Abstract This study indicates the importance of structure optimization and analysis for investigating direct screen-printed pastes of carbon based microstructures for use in flexible thermal interface material (TIM). The basalt fiber that is used as… read more here.

Keywords: thermal interface; interface; basalt particles; interface materials ... See more keywords
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Laminar Metal Foam: A Soft and Highly Thermally Conductive Thermal Interface Material with a Reliable Joint for Semiconductor Packaging.

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Published in 2021 at "ACS applied materials & interfaces"

DOI: 10.1021/acsami.0c22434

Abstract: Future electronic packaging technology requires semiconductor chips having a larger size and higher power for advanced applications, e.g., new energy conversion systems, electric vehicles, and data center servers, yet traditional thermal interface materials (TIMs) with… read more here.

Keywords: thermal interface; laminar metal; packaging; indium ... See more keywords
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3D Graphene-Nanowire “Sandwich” Thermal Interface with Ultralow Resistance and Stiffness

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Published in 2023 at "ACS Nano"

DOI: 10.1021/acsnano.2c10525

Abstract: Despite the recent advancements of passive and active cooling solutions for electronics, interfaces between materials have generally become crucial barriers for thermal transport because of intrinsic material dissimilarity and surface roughness at interfaces. We demonstrate… read more here.

Keywords: graphene nanowire; sandwich thermal; interface; thermal interface ... See more keywords
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A Paper-Like Inorganic Thermal Interface Material Composed of Hierarchically Structured Graphene/Silicon Carbide Nanorods.

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Published in 2019 at "ACS nano"

DOI: 10.1021/acsnano.8b07337

Abstract: With the increasing integration of devices in electronics fabrication, there are growing demands for thermal interface materials (TIMs) with high through-plane thermal conductivity for efficiently solving thermal management issues. Graphene-based papers consisting of a layer-by-layer… read more here.

Keywords: plane thermal; thermal interface; interface; thermal conductivity ... See more keywords
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Magnesium-induced preparation of boron nitride nanotubes and their application in thermal interface materials.

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Published in 2019 at "Nanoscale"

DOI: 10.1039/c9nr03915e

Abstract: The effective growth of boron nitride nanotubes (BNNTs) by boron oxide chemical vapor deposition (BOCVD) is extremely challenging, especially in a horizontal tube furnace. Herein, we propose a novel Mg-induction strategy, which is low cost… read more here.

Keywords: thermal interface; boron nitride; interface materials; nitride nanotubes ... See more keywords