Towards Robust Thermal MEMS: Demonstration of a Novel Approach for Solid Thermal Isolation by Substrate-Level Integrated Porous Microstructures
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DOI: 10.3390/mi13081178
Abstract: Most current thermal MEMS use fragile structures such as thin-film membranes or microcantilevers for thermal isolation. To increase the robustness of these devices, solid thermal insulators that are compatible with MEMS cleanroom processing are needed.… read more here.
Keywords: solid thermal; porous microstructures; thermal isolation; novel approach ... See more keywords