In Situ Measurement Method for Temperature Profile Optimization During Thermocompression Bonding Process
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DOI: 10.1109/tcpmt.2020.3026927
Abstract: Thermocompression bonding (TCB) is an important process in electronic packaging and is widely seen as a promising technology for miniaturized electronic devices. However, this process usually yields a lower throughput compared to more conventional mass-reflow… read more here.
Keywords: thermocompression bonding; temperature profile; heating rates; process ... See more keywords