Analysis of thermally induced delamination of thermoelectric thin film/substrate system
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DOI: 10.1007/s10704-018-0328-1
Abstract: Thermoelectric thin film/substrate structures have many practical applications such as in heat recovery systems. The general problem of thermally induced delamination between a thermoelectric thin film and a substrate is investigated. The temperature varies along… read more here.
Keywords: film substrate; delamination; thin film; thermoelectric thin ... See more keywords