Modeling and Experimental Verification of Intermetallic Compounds Grown by Electromigration and Thermomigration for Sn-0.7Cu Solders
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-018-6786-4
Abstract: Printed circuit boards that use fine pitch technology have a greater risk of open-circuit failure, due to void formations caused by the growth of intermetallic compounds. This failure mode is reported to be a result… read more here.
Keywords: imc growth; electromigration; intermetallic compounds; thermomigration ... See more keywords
Surface thermomigration of 2D voids
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DOI: 10.1063/5.0228961
Abstract: In a thermal gradient, surface nanostructures have been experimentally observed to move due to thermomigration. However, analytical models that describe the thermomigration force acting on surfaces are still controversial. In this work, we start from… read more here.
Keywords: thermomigration voids; energy; surface thermomigration; velocity ... See more keywords
Crystal defects in solar cells produced by the method of thermomigration
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DOI: 10.1134/s1063782617030162
Abstract: The results of studying the crystal structure of regions in silicon, recrystallized during the course of thermomigration of the liquid Si–Al zone in the volume of the silicon substrate, are reported (similar regions doped with… read more here.
Keywords: cells produced; crystal defects; produced method; thermomigration ... See more keywords
Equilibrium shape of thermomigration Al-doped channels in Si wafers
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DOI: 10.1177/02670836251371444
Abstract: Closed channel structures with interfaces formed by p – n junctions, used in high- current electronics, can be formed by the aluminum thermomigration in single-crystal silicon wafers. The equilibrium shape of self-formed channels, depending on… read more here.
Keywords: elastic energy; shape; wafers equilibrium; equilibrium shape ... See more keywords