Modeling and Experimental Verification of Intermetallic Compounds Grown by Electromigration and Thermomigration for Sn-0.7Cu Solders
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DOI: 10.1007/s11664-018-6786-4
Abstract: Printed circuit boards that use fine pitch technology have a greater risk of open-circuit failure, due to void formations caused by the growth of intermetallic compounds. This failure mode is reported to be a result… read more here.
Keywords: imc growth; electromigration; intermetallic compounds; thermomigration ... See more keywords
Crystal defects in solar cells produced by the method of thermomigration
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DOI: 10.1134/s1063782617030162
Abstract: The results of studying the crystal structure of regions in silicon, recrystallized during the course of thermomigration of the liquid Si–Al zone in the volume of the silicon substrate, are reported (similar regions doped with… read more here.
Keywords: cells produced; crystal defects; produced method; thermomigration ... See more keywords