Optimal Ni(P) thickness and reliability evaluation of thin-Au/Pd(P)/Ni(P) surface-finish with Sn-3.0Ag-0.5Cu solder joints
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2019.07.184
Abstract: Abstract We investigated the interfacial reactions and mechanical reliabilities of different Ni layer thicknesses and P-containing Pd layers in thin electroless-Ni electroless-Pd immersion gold (thin-Au/Pd(P)/Ni(P)) surface-finished printed circuit board (PCBs) with Sn-3.0Ag-0.5Cu (SAC 305) solder… read more here.
Keywords: thin surface; layer; solder joints; 0ag 5cu ... See more keywords
Redistribution of Erbium and Oxygen Recoil Atoms and the Structure of Silicon Thin Surface Layers Formed by High-Dose Argon Implantation through Er and SiO2 Surface Films
Sign Up to like & getrecommendations! Published in 2018 at "Semiconductors"
DOI: 10.1134/s1063782618130055
Abstract: Using analytical high-resolution electron microscopy, the Si structure and the redistribution of Er and O recoil atoms embedded in thin (~10 nm) surface layers by Ar+ implantation with an energy of 250–290 keV and a dose… read more here.
Keywords: surface; thin surface; recoil atoms; surface layers ... See more keywords