Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing
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DOI: 10.1007/s13391-020-00226-z
Abstract: Abstract Ultra-thin wafer fabrication has become a hot spot in recent years with the growing demand for small size and high performance electronic devices. However, far less research focused on the damage behavior in ultra-thin… read more here.
Keywords: dry polishing; ultra thin; thin wafer; wafer ... See more keywords