Sub-damage-threshold plasma etching and profile tailoring of Si through laser-stimulated thermal desorption
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DOI: 10.1116/1.4991586
Abstract: A laser-assisted plasma etch process is presented as an alternative to reactive ion etching for Si wafer processing in upcoming integrated circuit technology nodes. Poly-Si films were etched using an upstream 13.56 MHz inductively coupled plasma… read more here.
Keywords: laser; damage threshold; sub damage; threshold plasma ... See more keywords