Numerical simulation and experiments to improve throwing power for practical PCB through-holes plating
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DOI: 10.1108/cw-05-2018-0033
Abstract: Purpose The purpose of this study is to investigate the synergism of convection, current density distribution and additives by numerical simulation and electrochemical experiments for good throwing power (TP) of copper electro-deposition in printed circuit… read more here.
Keywords: numerical simulation; throwing power; pcb; simulation ... See more keywords