Laboratory and beam-test performance study of a 55 µm pitch iLGAD sensor bonded to a Timepix3 readout chip
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DOI: 10.1088/1748-0221/19/11/c11006
Abstract: This contribution reports on characterisation results of a large-area (2 cm2) small pitch (55 µm) inverse Low-Gain Avalanche Detector (iLGAD), bonded to a Timepix3 readout chip. The ilGAD sensors were produced by Micron Semiconductor Ltd… read more here.
Keywords: timepix3 readout; pitch; bonded timepix3; beam ... See more keywords